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  • Silicon Photonics Chip Project Engineer

    Job Responsibilities:1. Participate in the development and testing of integrated device and chip projects; 2. Responsible for review reports, formulation of DFMEA, document writing, related to product development; 3. Product development revision, process optimization, proposal and design of cost reduction plan; 4. Responsible for tracking and solving problems in the R&D and trial production stage of the product; 5. Patent output.

    Qualifications:1. Ph.D or above, major in optoelectronic science and technology; 2. Experience in data center, silicon photonic chip design and tape-out, rich experience in design and tape-out of grating coupler, SSC coupler, MMI, Spliter, high-speed MZ modulator, high-speed Ge/Si PD, etc. is preferred ; 3. Proficiency in using mainstream optical waveguide design software such as Luceda, Lumerical FDTD and Phenix Software; 4. Proficiency in using HFSS or other high-frequency transmission line design software; 5. Proficiency in using semiconductor carrier analysis software such as Atlas; 6. Able to use Matlab to model the simulation results of the above three types of software, and output the chip performance simulation results; 7. Proficiency in using L-edit or other software to draw silicon photonics chip layout; 8. Understand the various processes of CMOS tape-out, and be able to follow up the silicon photonics design tape-out process.

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  • Radio Frequency Automation Development Engineer

    Job Responsibilities:1. BAW filter design: related work on modeling and calculation of equivalent RF circuits (linear, nonlinear,) RF test data fitting and high power of BAW; 2. PDK software automation: ADS/comsol/HFSS simulation software, connecting with python/matlab and other automation software; 3. MEMS technology: conducting statistical analysis on the knowledge and data of real production and microelectronics technology.

    Qualifications:1. Ph.D or above, major in communication engineering, microwave, radio frequency design, etc., familiar with RF, microwave, electromagnetic theory, etc.; 2. Have a certain basic programming ability, and be able to use MATLAB, Python, C, Ruby, etc. for algorithm simulation; 3. Familiar with the design and support of components such as RF filter (filter), power amplifier (PA), low noise amplifier (LNA), switch (Switch), etc. FBAR development experience is preferred; 4. Have experience in electromagnetic simulation such as ADS, HFSS, etc., and be familiar with the use of related software; 5. Familiar with the use and calibration methods of test equipment such as network analyzers, spectrum analyzers, power generators, and RF probes is preferred; 6. Be proficient in writing technical documents, and have good document preparation habits and writing standards.

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  • MEMS Chip Design and Development Engineer

    Job Responsibilities:1. Responsible for MEMS sensor chip layout design, structural design, process confirmation and development; 2. Responsible for the simulation of MEMS sensor chips, using finite element analysis software for multi-physics simulation, writing simulation programs, etc.; 3. Responsible for the development of MEMS sensor chip process flow, including laboratory process verification and mass production process development and optimization; 4. Responsible for microscopic analysis of MEMS sensor chips, using SEM, X-RAY, etc. for chip failure analysis; 5. Maintain close contact with the foundry, and commit to promoting the MEMS production process from prototype to mass production; 6. Analyze MEMS product data in production and engineering tests, verify MEMS process changes, design and execute engineering tests to solve process problems or optimize process performance; 7. Assist in completing the design, testing and verification of related module-level products.

    Qualifications:1. Ph.D or above, major in electronics, microelectronics, MEMS or semiconductor materials; 2. Proficiency in using MEMS layout design software for layout design, with related work experience in plate making and plate casting; 3. Proficiency in using related design and simulation software for chip structure design and finite element analysis, including thermoelectric, fluid, piezoresistive, piezoelectric and other multi-physical field simulations; 4. Understand the conventional MEMS process of chip processing, such as photolithography, etching, coating, etc., and be able to formulate the processing process of chip samples; 5. Ability to test and analyze chip performance indicators, experience in MEMS pressure chip design is preferred.

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