Description Power device testing needs to be carried out under extreme test conditions such as high temperature of 350°C, low temperature of -70°C, high voltage of 10KV, high current of 600A, etc. In order to protect the device...
Description The wafer test probe station can screen bad chips at the wafer level in advance to prevent them from flowing into the back-end process; thus saving the overall packaging and testing cost. In order to meet the...
Description ETSC Sip-Chip/Bar automatic test system covers a variety of chips, including passive and active chips. The system uses required instruments to test chip performance indexes, such as IL, ER, RL FSR, Responsivity, etc. Vision algorithm can realize...
Description WI-6500 supports 25 wafer automatic-defect inspection systems. 25 6-inch wafers are carried into the system inspection wafer cassette by the shipping wafer cassette, the equipment closes the hatch. The vision system scans the number and position of...