WI-6500 Automatic Wafer Defect Inspection System

Description

WI-6500 Automatic wafer defect inspection system is consisted of machine vision inspection system, automatic loading and unloading system, automatic inspection system and control software.

The system supports automatic defect inspection of 25 wafers (1 cassette). It can detect the number and position of wafers in the wafer cassette, quickly detect the defect position, extract the defect image, and fifinally generate the defect map. The results are stored in the system database of the production line for operators and engineers to analyze the defects of the products.

Compared with manual inspection, this system has obvious advantages. It can perform long-term high-precision and high-efficiency inspection with high accuracy, which can greatly improve produc tion efficiency and inspection accuracy, reduce costs and increase efficiency for customers.

Features

  • Minimum defect: 0.5μm
  • Compatible wafer size: 6 inches, 8 inches, other sizes can be customized
  • Automatic loading and unloading, Maximum test volume per batch: 25pcs
  • Autofocus and layered focus image capture
  • Automatic machine vision inspection
  • Defect analysis, generating map report

Application

WI-6500 is suitable for inspecting defects such as stains, scratches, bumps, breaks, discolorations and size errors on wafers.

Parameter

Wafer defect inspection system

Type of inspection

Bright field, dark field

Imaging type

Color, black and white

Inspecting magnification

1.25X, 2.5X, 5X, 10X, 20X

Inspecting defect

Manual/ automatic

Inspecting time1

≤15

min

Defect inspection Capture Rate

99%(>3Pixel)

Defect inspection fail rate

1%

Retest rate

1%

SiPh platform

Wafer size

6/8

inches

Auto-focus

The lens is equipped with a Z-axis motor for autofocus

XY and rotary stage

The inspection requires a motor platform in the XY direction, and the calibration requires a rotary table

Auto-loading

Material loading

1 wafer cassette is loaded each time, and 1 wafer cassette can hold 25 wafers

Pre-calibration

Automatic pre-calibration prior to wafer inspection

Use environment

Cleanliness level

Level 100

Environment temperature

10~45

Environment humidity

30~70

%RH

General characteristics

Power

AC 220V ± 10%

Dimension

D 1320 * W 1082 * H 2116

mm

Weight

648

kg

Ground bearing capacity

≥800

kg/m²

Remark:
  1. Inspection time for each 6” wafer.
All Information given here is reliable to our best knowledge. No responsibility is assumed for possible inaccuracies or omissions. Specifications and external appearances are subject to change without notice.