Description
WI-6500 Automatic wafer defect inspection system is consisted of machine vision inspection system, automatic loading and unloading system, automatic inspection system and control software.
The system supports automatic defect inspection of 25 wafers (1 cassette). It can detect the number and position of wafers in the wafer cassette, quickly detect the defect position, extract the defect image, and fifinally generate the defect map. The results are stored in the system database of the production line for operators and engineers to analyze the defects of the products.
Compared with manual inspection, this system has obvious advantages. It can perform long-term high-precision and high-efficiency inspection with high accuracy, which can greatly improve produc tion efficiency and inspection accuracy, reduce costs and increase efficiency for customers.
Features
- Minimum defect: 0.5μm
- Compatible wafer size: 6 inches, 8 inches, other sizes can be customized
- Automatic loading and unloading, Maximum test volume per batch: 25pcs
- Autofocus and layered focus image capture
- Automatic machine vision inspection
- Defect analysis, generating map report
Application
WI-6500 is suitable for inspecting defects such as stains, scratches, bumps, breaks, discolorations and size errors on wafers.
Parameter
Wafer defect inspection system
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Type of inspection |
Bright field, dark field |
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Imaging type |
Color, black and white |
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| Inspecting magnification |
1.25X, 2.5X, 5X, 10X, 20X |
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Inspecting defect |
Manual/ automatic |
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Inspecting time1 |
≤15 |
min |
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Defect inspection Capture Rate |
99%（>3Pixel） |
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Defect inspection fail rate |
1% |
– |
| Retest rate |
1% |
– |
SiPh platform
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Wafer size |
6/8 |
inches |
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Auto-focus |
The lens is equipped with a Z-axis motor for autofocus |
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XY and rotary stage |
The inspection requires a motor platform in the XY direction, and the calibration requires a rotary table |
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Auto-loading
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Material loading |
1 wafer cassette is loaded each time, and 1 wafer cassette can hold 25 wafers |
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Pre-calibration |
Automatic pre-calibration prior to wafer inspection |
– |
Use environment
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Cleanliness level |
Level 100 |
– |
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Environment temperature |
10~45 |
℃ |
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Environment humidity |
30~70 |
%RH |
General characteristics
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Power |
AC 220V ± 10% |
– |
| Dimension |
D 1320 * W 1082 * H 2116 |
mm |
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Weight |
648 |
kg |
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Ground bearing capacity |
≥800 |
kg/m² |
Remark:
- Inspection time for each 6” wafer.
