Description
WIT-220 Wafer optical-electrical probe station comprehensively considers the design requirements
of stability, electrical noise processing and spatial layout. It adopts high-precision motion control
system, high-performance vibration isolation system and combines self-developed image software
algorithms to achieve small beam diameter optical performance test and high-precision electrical
performance test.
It not only can meet the application requirements of high-precision optical test indicators and pA/nA
micro-signal measurement, but also can eliminate the bad chips at wafer level in advance, prevent
them from flowing into the back-end process, save the overall packaging and testing costs and
improve production efficiency.
Features
- Automatic calibration with machine vision
- Automatic crimping of probes/probe cards
- Automatic light search
- Support small beam diameter chip testing
- Wafer size 2~12inches, customization upon requests
- Temperature range -20℃ ~ 125℃（wider range upon request）
- Customized functions such as automatic loading and unloading and automatic defect inspection are optional
- A complete set of testing solution services upon request
Application
In OO, OE and other technical testing fields, optical testing is compatible with SMF, Lensed Fiber, FA,
etc.. Electrical testing is compatible with probe holders or probe cards, meeting the testing needs of
various application scenarios in R&D and mass production.
Parameter
Basic parameters
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Wafer size |
2~12 inches, customized, with partition design |
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Loading method |
Manual/Auto Loader |
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Number of testing |
Single wafer/Cassette |
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Optical performance parameters
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Type of fiber |
SMF |
Lens fiber |
FAU |
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Fixture |
V-groove |
V-groove |
holder |
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Testing method |
GC |
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Coupling repeatability |
0.3dB (Typical value) |
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Automatic calibration |
After the wafer is loaded, using image recognition to identify Wafer-ID, and automatically calibrates the position and angle |
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Automatic optical alignment |
Image recognition to assist automatic light alignment |
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Automatic positioning compensation |
±2um positioning accuracy |
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Coupling stability |
0.5dB / 15min (typical value) |
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| Automatic compensation in height direction |
√ |
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Automatic calibration of rotation center |
√ |
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Sensor collision avoidance |
√ |
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Method to search light |
Spiral, Matrix, Fast 3D |
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Electrical performance parameters
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Number of integrated probes |
Dozens to hundreds, customized according to needs |
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Power-up type |
Probe holder/probe card |
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| Type of probe card |
Cantilever/Vertical Needle Probe Cards |
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Needle Clearing Type |
Manual/ automatic |
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Needle Accuracy of probe card |
±2um |
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Temperature |
-20℃ ~ 125℃ | ||
Remarks：The alignment stage can be replaced to achieve higher precision testing.
All Information given here is reliable to our best knowledge. No responsibility is assumed for possible inaccuracies or omissions. Specifications and external appearances are subject to change without notice.
